| Abstract [eng] |
This work investigates polyols – glycerol and sucrose – as an alternative ligand for electroless copper plating systems with reducer formaldehyde. Natural polyols are environmentally friendly, easily bio-degradable materials, but has not been studied enough for suitability for copper plating systems. In order to increase of the efficiency, the electroless copper plating was investigated in ultrasonic milieu to observe how ultrasound impacts the copper plating rate and properties of the obtained coatings. Studies have shown that sucrose and glycerol can be used as ligands in solutions for electroless copper plating. A plating rate of copper under optimum conditions can reach 2.2 m h-1 (sucrose) and 3.4 m h-1 (glycerol) and copper surface roughness factors ranging 8.5 - 25.3 (sucrose) and 2,3 - 4.3 (glycerol). Correlations between dependences on pH observed for copper plating speeds, overpotentials, surface roughness factors, anodic oxidation currents of formaldehyde. A use of ultrasound for electroless copper plating systems change speeds. Depending on the choice of copper plating system and ultrasonic frequency, plating rate can decrease or may increase up to 5 times and can reach high values (10.87 m h-1). The copper surface formed in ultrasound environment more compact, smoother. |
