| Abstract [eng] |
The objective of the thesis is to investigate applicability of high pulse repetition rate picosecond lasers for microfabrication and to clarify high repetition rate pulse interaction with metals and silicon. The ablation threshold and accumulation rate dependence on the laser pulse duration for silicon and metals has been experimentally studied. The model of optimal focus conditions for the maximum ablation rate was developed and experimentally confirmed. The material evaporation rate decreases duo to plasma screening for high pulse energies. Various pulse length lasers have been used for cutting and drilling of silicon. In this work key properties of laser radiation, radiation absorption, ablation and plasma formation are discussed. Surface spectroscopy methods have shown that laser cutting of silicon in the air leads to the cut surface doping with carbon atoms up to 5 µm depth from carbon dioxide in the atmosphere, and the resulting silicon carbide influences the laser cut quality. Testing of applicability of high pulse repetition rate picosecond lasers for the production of complex shapes, relationships between surface roughness and process parameters were determined. Heat abstraction from the workpiece, during laser cutting of stents from nitinol, limits the potential use of the average laser power and the effective cutting speed The silver and gold picosecond laser ablation in the liquid medium generates a narrow size distribution of nanoparticles, which form a stable colloidal solution. |
