| Abstract [eng] |
The main idea of this work was to fabricate three-dimensional structures in fused silica and sapphire using FLICE - femtosecond laser irradiation followed by chemical etching. The goal was to find the optimal process parameters. It was found, that the best laser parameters for the fastest fused silica selective etching when pulse duration is equal to 270 fs are these: laser pulse energy - 600 nJ, pulse density 2000 imp/μm. Fused silica etching speed was 984 μm/h. There was designed, fabricated and tested aspherical lens system which has good focusing features, also we embedded Laval micronozzles in to fused silica volume. For the sapphire micromachining, new method was applied. The laser beam was split in to two equal energy beams with orthogonal polarisations and these beams were combined in space and time with no delay. The best laser parameters for the fastest sapphire selective etching when pulse duration is 600 fs are these: laser pulse energy - 130 nJ, wavelength - 1030 nm, pulse density 2000 imp/μm. Sapphire etching speed was 124 μm/h. A microcylinder through whole sapphire depth of 3 mm was written with laser, however ethcing time of 65 hours was not long enough for whole body etching. |
