| Abstract [eng] |
In this thesis, laser-assisted selective chemical copper deposition on dielectrics, and its application for formation of electric circuit traces was investigated. Two approaches of selective plating methods were proposed and tested: laser direct structuring (LDS) of polypropylene with carbon nanotubes additive and the newly-developed technology Selective Surface Activation Induced by a Laser (SSAIL). Laser direct structuring is based on special additives called LDS additives mixed in whole volume of the polymeric part. Laser beam activates those additives, making them an active catalyst for electroless copper plating in the bath. Thus, only laser-written areas are deposited. In this work, new type of additives, multiwall carbon nanotubes were investigated. Experimental studies of activation process were performed with the sheet resistance measurements, scanning electron microscope analysis and Raman spectroscopy. SSAIL is a new technology developed during the PhD studies period. The method contains steps: laser excitation of the surface, wet chemical activation with a catalyst, rinsing and electroless copper deposition in the bath. Experimental results showed that the selective plating process is not caused only by surface roughness. Sheet resistance measurement, XPS analysis and microscope images have been used to analyse the process after the laser modification, activation and plating steps. Results of activation mechanism revealed that process works only after picosecond laser modification. XPS analysis has shown that PA6 after laser processing has reducing properties of metals ions. |
